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Our Missions

  • To provide services and expertise on screening/testing of electronic components and products to insure the quality standards on the market for Consumer Protection prior to shipment.
  • To develop test strategies and specific screening of electronic components for the needs of customers
  • To provide high quality products to serve the needs of our customers

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    Company Establishment [read:959]
    Address: Science and Technology Park, Nanshan District, Shenzhen, Guangdong, China
    Email : info@adv-lab.com
    Tel: (86)755-33631177, 33631178,33631179
    Fax: (86) 755-33300968

    Position:  Home --> Services Ic test / Project development / Equipment / Logistics
    As an independent party providing services including third-party inspection and testing, Advanced-lab ensures that your interests are protected and that quality products are procured. Through inspections we determine if your merchandise meets specific requirements or any explicit guidelines you have requested.

    We offer inspection services to cover China region.

    Our engineers are fully trained and equipped with the capability to inspect and test a large variety of electronics products.
    Inspections will typically include visual and manual examination for criteria such as:
    Component Physical Inspection
    Component physical inspection is based on Five external physical inspection criteria:

    1. FOREIGN MATERIAL
    1.1 Bridging Leads
    1.2 Bridging Lid to Leads
    1.3 In Seal Material
    1.4 On Lead(s)
    1.5 On Package

    2. LEAD CONDITION
    2.1 Bent
    2.2 Corroded
    2.3 Misaligned
    2.4 Missing
    2.5 Nicked, Cut or Scored

    3. MARKINGS
    3.1 Illegible
    3.2 Non-conformant to customer paper work
    3.3 Non-homogeneous from part to part
    3.4 Smeared or removed

    4. PACKAGE CONDITION
    4.1 Broken
    4.2 Chipped
    4.3 Cracked
    4.4 Crazed or bubbled surface
    4.5 Physical Dimensions

    5. SEAL(S)
    5.1 Crack(s) in seal material
    5.2 Excessive seal material
    5.3 Misaligned lid to package
    5.4 Void(s) in seal
    5.5 Weld splatter
    5.6 Evidence of a cold solder joint
    Functional Test
    Functional Tests is to determine the paramters and performance of unit under tests. Functional test of a component could be simple or very complicated depending on the component type.

    Test method will normally require the designing and building of hardware or software to test the component function based on the component’s specification.

    Therefore evaluation for conducting functional test will be required for each device.
    ROHS Test
    ROHS is the compliance test for Lead free. The technique used for the ROHS screening is a wavelength dispersive X-Ray fluorescence spectrometer.

    The analysis chart will be attached to the report with the % level of the lead element.

    Pass/fail will be determined and based on the standard of the ROHS initiative.
    X-Ray
    This will be an internal component inspection based on the image obtained via an X-ray machine. This will be an inspection of the short/open circuit inside a components under tests.
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